| Hscode | Description | MFN rate | Temperate rate | Comsumer rate | Vat rate | US additional | CA additional | Detail |
|---|---|---|---|---|---|---|---|---|
| 8486402200 | Other types of lead bonding device (mainly or exclusively used for assembling and encapsulating semiconductor devices and integrated circuit devices) | 0% | - | 0% | 13% | 10% | More |